Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD

EQ-ECO-419-LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with  < 6" diameter vacuum chuck. SPECIFICATIONS:

Width	6.5"
Thickness	0.25mm
Length	Price sold by 10 feet per quantity
Item	It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing.
Application Notes