PRO Line PVD 200 – Versatile Sputtering, Electron Beam, & Thermal Evaporation Deposition Platform

Modular Process Chamber

• Box chamber , 304 SS, 19.25" wide x 20.5" deep x 24" high (488.95mm Wide x 520.7mm Deep x 609.6mm High), internal dimensions for sputtering applications or shorter throw evaporation / e-beam
• Box chamber , 304 SS, 19.25" wide x 20.5" deep x 36" high (488.95mm Wide x 520.7mm Deep x 914.4mm High), internal dimensions for sputtering long throw evaporation / e-beam
• These chambers come standard with up to ten spare ports (2-3/4" CF) depending on system configuration.
• Please see the performance tab (above) for information on pumpdown times and base pressures

Vacuum Pumping & Gauging

• Pfeiffer 790 L/s turbomolecular pump with a KJLC RV212 oil sealed roughing pump. Base pressure for a properly conditioned chamber is 9 x 10-7 torr (1.2 x 10-6 mbar).
• Wide range gauge reads from atmosphere to 10-9 Torr.

Safety

Fully enclosed system electronics rack.

• *Compact frame, 79.5" (2019.3mm) wide x 32" (812.8mm) deep x 75.9" (1928mm) high
• All electrical components are safely housed behind lockable cabinet doors.
• EMO Protection is standard on all KJLC systems.
• Isolation transformer and safety interlocks are standard on all KJLC systems.

*System dimensions and mounting dependent on options selected.

HV Pumping Options

• Turbo Pump – This package replaces the 790 L/sec turbo pump in the base system with a HiPace 1,250 L/sec turbo pump. Base pressure for a properly conditioned chamber is 5 x 10-7 Torr (6.7 x 10-7 mbar).
• Cryo Pump – This package replaces the 790 L/sec turbo pump in the base system with a CTI-8F 1500 L/sec cryo pump. Base pressure for a properly conditioned chamber is 8 x 10-8 torr (1.1 x 10-7 mbar).
• Cryo Pump - This package replaces the 790 L/sec turbo pump in the base system with a CTI-10 3000 L/sec cryo pump. Base pressure for a properly conditioned chamber is 5 x 10-8 torr (6.7 x 10-8 mbar).
• Dry Pump – Edwards nXDS10i – 6.7 cfm (11.4 m3/hr) Scroll roughing pump.
• Dry pump – Edwards XDS35i – 25 cfm (43 m3/hr) Scroll roughing pump.

HV Valves

• 3-position gate valves are standard on all pumping options for the PVD 200.
• Variable position downstream pressure control valves, typically used for sputtering applications are available as an option.

Upstream Pressure Control

• Up to four Fujikin FCST1000F Mass Flow controllers and a 100mTorr Capacitance Manometer

Magnetron Sputtering Source Power Supplies

• IMPULSE™ - 2kW Pulsed Power Modules for Advanced Magnetron Sputtering
  • Available in sputter / bias configurations
  • For more information click here
• 500W, and 1kW, and 1.5kW KJLC® DC power supplies
• 300W and 600W KJLC RF power supplies
• 2kW (pulsed) DC power supply

Torus® Magnetron Sputtering Source (Up to eight)

• Up to eight KJLC Torus® 2" or 3" magnetron sputtering sources. Flex head assembly and high strength magnet assemblies options available.
• Up to six KJLC Torus® 4" magnetron sputtering sources. Flex head assembly and high strength magnet assemblies options available

For more information on our new Mag Keeper sources please see the following link.

Electron Beam Evaporation Source

• KJLC KL6, four pocket (8cc) E-Beam source
• KJLC KL8, eight pocket (12cc) or six pocket (20cc) E-Beam source
• 5kW or 10kW solid state power supply with programmable sweep and automatic crucible indexing

Thermal Evaporation Source

• KJLC Thermal evaporation (TE) assembly, Up to six 4" thermal evaporation sources (in sequential or co-deposition configurations)
• Standard thermal power supply, up to 12V or 400A, max 2kW applied power
• High output power options, up to 12V or 600A, max 2.5kW applied power
• KJLC 10cc LTE (Low Temperature Evaporation) source, suitable for Organic and low temperature materials (0-550°C)
• Quartz crystal controller is available with thermal options

Standard Substrate Fixtures

• Suitable for substrates up to 8" (200mm) in diameter
• 20 RPM, 850°C heat or water cooled
• Up to 100W RF bias
• Automated transfer

Ion Source

• eH400, End-Hall permanent magnet ion source or KDC40 Gridded ion source
• eH400 End-hall source is a versatile ion source capable of high current, low energy ion cleaning or etching while limiting damage to substrate surfaces
• KDC40 Gridded ion source allows precise beam shaping with interchangeable ion optics and independent operation of important ion beam properties

Reactive Depositions

• One Fujikin FCST1000F Mass Flow controller and a 100mTorr Capacitance Manometer
• Up to three Fujikin FCST1000F Mass Flow controllers for a reactive gas.
• Substrate gas ring is available

Single Substrate Load Lock

• Low profile design
• Load Lock, turbo pump, and all appropriate gauging
• Compatible with substrates up to 200mm, multisite adapter for smaller substrates
• 67 L/s turbomolecular pump set with isolation valve
• Roughing pump shared with process chamber
• Isolation valve between load lock and process chamber

Pumping:

The PRO Line PVD 200 offers four types of high vacuum pumping on its process chamber, a Pfeiffer 790 L/s turbomolecular pump (standard), as well as an optional 1250L/s Pfeiffer turbomolecular pump, Brooks CTI-8F 1500 L/s, or 3000 L/s cryo pump. The Pfeiffer turbomolecular pumps being a good choice for overall cost effective high quality pumping particularly for sputtering applications. The Brook CTI cryo pumps find use in applications that require the lowest vacuum possible, particularly for thermal evaporation and electron beam applications.

The chart to the right demonstrates average expected pumping performance by pump type for an outfitted PRO Line PVD 200 process chamber that is clean and dry with (5) Torus 3" Mag-keeper sources installed and a 3' long 1.5" metal flex bellows roughing line.

Pump data for a clean dry and empty PRO Line PVD 200. Pumping performance is depending on chamber conditions and components installed.

The PVD 200 was re-designed to mount the high vacuum valve directly to the process chamber without the 4" half nipple and accommodates a larger 790 L/s pump, 1250L/s pump, or CTI8 pump. This allows the PRO Line PVD 200 to reach lower base pressures and faster pumpdown times than similarly equipped systems. The CTI10 Cryo pump does require a pumping port nipple and will limit some options.

Deposition:

The PRO Line PVD 200 is one of Kurt J. Lesker's most versatile thin film deposition systems offering single and multi-technique deposition options including thermal evaporation, magnetron sputtering (Torus), and electron beam.

Only KJLC offers Mag-Keeper sputter sources with zero o-rings in the cathode body and a magnetically coupled target to allow for easy target changes. Our "patent pending" cooling well design enables operation at power densities up to 200 watts/.in2. This cathode is designed to sputter up to a 0.375" thick targets. Without a hold down clamp or dark space shield this cathode is capable of running as low as ≤ 1mTorr (material dependent). The unique dome shutter design eliminates the need for additional cross contamination shielding required with standard flip or swing shutters.

To learn more about sputtering rates and uniformity, click here.

KJLC E-beam sources are also designed to eliminate unnecessary o-rings, seals, and feedthroughs to lower pumpdown times and provide excellent base pressures. Only three feedthrough's are required for the KJLC E-beam source and there is no dynamic water to vacuum o-ring seal in this design which greatly reduces the risk of a water leak in the vacuum chamber.

Thermal evaporation sources typically centered on the substrate fixture have been moved to the outer edges of the fixture to allow for better uniformities. The fixtures allow a source adjustment of up to an inch to allow for optimization to a particular application.

Typical Deposition Uniformities

The PRO Line PVD 200 has been designed for optimal uniformities and allows ultimate base pressures otherwise not achievable in modular R&D systems until now. The chart to the left shows average expected uniformity by deposition type and substrate wafer diameter. Thickness measurements were made using a Profilometer or spectral reflectometer. The actual uniformity achievable will be a function of the final configuration of the system and process parameters.

Torus® sources are operated at typical sputtering pressures (< 20 mTorr) and utilize Si wafers for deposition. SiO2 Target run with RF Power, film thickness >=500Å. Al Target run with DC Power, film thickness >=1500Å. Ni Target run with High Strength Torus® & DC Power, film thickness >=1500Å.

KJLC electron beam deposition runs utilize Si wafers for deposition. Ti evaporant material with film thickness >=1500Å.

• All Films are measured on a properly calibrated Profilometer, Reflectometer or Ellipsometer (if applicable).
• Measurement points are taken starting at the center of the substrate and then radially outward every 0.5 inches (12.7mm), nominally (reference figure to the right).
• Uniformity calculation formula is: ((Max - Min) / (2 x Avg)) x 100% with a 0.2 inch (5mm) edge exclusion.