MSU1000 Fitted Megasonic Cleaning System

Fitted megasonic cleaning system Megasonic cleaning technology not only preserves the advantages of ultrasonic cleaning technology, but also overcomes some of its shortcomings. The mechanism of megasonic cleaning technology is the chemical reaction of chemical cleaning agents combined with high-frequency vibration slices for cleaning. So far, the megasonic cleaning method has become the most widely used and effective method in polishing wafer cleaning. Generally, the particle size suitable for removal by megasonic cleaning is 0.1~0.3 μm, and the particle size suitable for removal by ultrasonic cleaning is above 0.4 μm. The effect of megasonic cleaning is gentler. Therefore, an appropriate vibration frequency should be selected according to the size of the particles to be removed and the impact force that the device on the wafer surface can withstand.