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MSN1000 Sprinkler Megasonic Cleaning Nozzle
Description
The principle of spray-type megasonic nozzle cleaning is mainly due to the effect of sound pressure gradient, particle velocity and sound flow, while the cavitation effect is secondary. cleaned. During cleaning, bubbles like ultrasonic cleaning are not formed, but the high-speed micro water flow formed by high-frequency sound wave energy in the cleaning solution continuously impacts the surface of the wafer, so that the surface of the object surface is less than 0.2μm. The contaminants and fine particles are forcibly removed and entered. into the cleaning solution.
Features
• Can remove tiny particles smaller than 0.2μm
• Avoid possible damage to the surface of the object caused by cavitation
• High-density energy provides efficient cleaning
• High-speed flow in a linear direction prevents impurities from re-adhering to the surface of the object
• Comprehensive non-metallic high anti-corrosion material, suitable for various acids, bases and organic solvents
• The megasonic generator of the third-generation semiconductor technology fully realizes digital high-frequency high-power drive
Basic Specifications
• Megasonic frequency 1000kHz
• Maximum power 40W
• Maximum power 1200-4800W
• Housing material PVC
• Housing material PEEK, PCTFE
• Suitable for wafers 6″, 8″, 12″
• Liquid temperature <70°C
• Ambient temperature 10-40°C
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