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Copper (Cu) Sputtering Targets
Description
Premier Solutions Pte Ltd is distributing Kurt J Lesker Coporation (KJLC) comprehensive offering of sputtering targets, evaporation sources and other deposition materials which is listed by material throughout the website. Technical specifications of Copper (Cu) Sputtering Targets and ordering information is available. Below you may find budgetary pricing for sputtering targets and deposition materials per your requirements. Actual prices may vary due to market fluctuations. Contact This email address is being protected from spambots. You need JavaScript enabled to view it. for current pricing or for a quote on sputtering targets and other deposition products not listed.
Specifications
| Material Type | Copper | Theoretical Density (g/cc) | 8.93 | |
| Symbol | Cu | Z Ratio | 0.437 | |
| Atomic Weight | 63.546 | Sputter | DC | |
| Atomic Number | 29 | Max Power Density(Watts/Square Inch) | 150 | |
| Color/Appearance | Copper, Metallic | |||
| Thermal Conductivity | 400 W/m.K | Type of Bond | Indium | |
| Melting Point (°C) | 1,083 | |||
| Coefficient of Thermal Expansion | 16.5 x 10-6/K | |||
Ordering Table
| Materials | Size | Purity | Parts # | Price |
| Copper | 1.0" Dia. x 0.250" Thick | 99.999% | EJTCUXX501A4 | P.O.R. |
| Copper | 1.0" Dia. x 0.250" Thick | 99.990% | EJTCUXX401A4 | P.O.R. |
| Copper | 2.0" Dia. x 0.125" Thick | 99.999% | EJTCUXX502A2 | P.O.R. |
| Copper | 2.0" Dia. x 0.125" Thick | 99.990% | EJTCUXX402A2 | P.O.R. |
| Copper | 2.0" Dia. x 0.250" Thick | 99.999% | EJTCUXX502A4 | P.O.R. |
| Copper | 2.0" Dia. x 0.250" Thick | 99.990% | EJTCUXX402A4 | P.O.R. |
| Copper | 3.0" Dia. x 0.125" Thick | 99.999% | EJTCUXX503A2 | P.O.R. |
| Copper | 3.0" Dia. x 0.125" Thick | 99.990% | EJTCUXX403A2 | P.O.R. |
| Copper | 3.0" Dia. x 0.250" Thick | 99.999% | EJTCUXX503A4 | P.O.R. |
| Copper | 3.0" Dia. x 0.250" Thick | 99.990% | EJTCUXX403A4 | P.O.R. |
| Copper | 4.0" Dia. x 0.125" Thick | 99.999% | EJTCUXX504A2 | P.O.R. |
| Copper | 4.0" Dia. x 0.125" Thick | 99.990% | EJTCUXX404A2 | P.O.R. |
| Copper | 4.0" Dia. x 0.250" Thick | 99.999% | EJTCUXX504A4 | P.O.R. |
| Copper | 4.0" Dia. x 0.250" Thick | 99.990% | EJTCUXX404A4 | P.O.R. |
| Copper | 5.0" Dia. x 0.250" Thick | 99.990% | EJTCUXX405A4 | P.O.R. |
| Copper | 6.0" Dia. x 0.125" Thick | 99.999% | EJTCUXX506A2 | P.O.R. |
| Copper | 6.0" Dia. x 0.125" Thick | 99.990% | EJTCUXX406A2 | P.O.R. |
| Copper | 6.0" Dia. x 0.250" Thick | 99.999% | EJTCUXX506A4 | P.O.R. |
| Copper | 6.0" Dia. x 0.250" Thick | 99.990% | EJTCUXX406A4 | P.O.R. |
| Copper | 8.0" Dia. x 0.125" Thick | 99.999% | EJTCUXX508A2 | P.O.R. |
| Copper | 8.0" Dia. x 0.250" Thick | 99.999% | EJTCUXX508A4 | P.O.R. |
| Copper | 8.0" Dia. x 0.250" Thick | 99.990% | EJTCUXX408A4 | P.O.R. |
Premier Solutions Pte Ltd - Copper (Cu) Sputtering Targets - CuST1
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