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Target Bonding

OFHC Copper Backing Plates

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Description

Features

Machined from oxygen-free, high-conductivity copper.

  • For regular, circular disc-type sputtering sources
  • Most sputter sources, including our TORUS® 1, 2, 3 cathodes, accept a 0.125" (1/8") thick target bonded to a 0.125" thick backing plate
  • For targets of other thicknesses, choose the backing plate thickness to adjust the total thickness to 0.250" (1/4") to suit most applications

NOTE:

  • They are suitable for most circular target sources from other manufacturers, although they may need minor machining for screw, clamps, etc.
  • Copper Cup Backing Plates available upon request.

 

Lesker OFHC Copper Backing Plates

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