Physical Vapor Deposition Systems (PVD)

Physical Vapor Deposition Systems (PVD)

Physical Vapor Deposition Systems (PVD)

Physical Vapor Deposition (PVD) is a broad term for deposition techniques that utilize the vaporized form of a desired coating material to create a deposited film on a substrate. Techniques include those that facilitate a physical (rather than chemical) vaporization of the base material, such as electron beam evaporation, thermal evaporation, point source evaporation, and magnetron sputtering.

The Kurt J. Lesker Company manufactures a wide array of PVD systems, including the aptly-named PVD Series, the NANO 36™ platform, the LAB 18 platform, the CMS Series, and the AXXIS platform.

Each of the PVD systems that The Kurt J. Lesker Company manufacture has a bevy of features and options suitable to tailor a platform for your particular application. These options include: load locks; various sputtering and evaporation sources; ion sources; substrate handling options such as heating, cooling, and biasing; and pumping options.

 

THERMAL SYSTEM

Thermal evaporation is a major thin film deposition technique particularly in R&D applications where the low installation costs and inexpensive, disposable evaporant “containers” are clear advantages.

 

说明: Click to view Photo-SY-PVD75_3QTR-THUMB.jpg说明: http://www.lesker.com/newweb/Vacuum_systems/jpg/Photo/Photo-SY-Nano36_02.jpg

 

THERMAL FOR ORGANIC

Organic material deposition is a specific subset of the thermal deposition technique. Due to the volatility of most organic compounds they must be handled differently than stable materials. Highly controllable and precise source temperatures must be used to facilitate evaporation of organic materials, and when loading/unloading sources it is usually desirable to control the surrounding environment through a glove box.

The Kurt J. Lesker Company manufactures three standard system platforms for organic material deposition, Mini-Spectros, Super Spectros 150, and Super-Spectros 200.

Each of the Spectros® systems that we manufacture has a variety of features and options suitable to tailor a platform for your particular process needs. These options include: glove boxes; various sputtering and evaporation sources; mask transfer and storage; wedge tool; pellet feeder; substrate handling options such as heating and cooling; and pumping options.

 

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ELECTRON BEAM EVAPORATION

In e-beam evaporation, free electrons generated by thermionic emission from a filament hit the evaporant’s surface.  Dissipation of the high-energy, high-current beam causes a temperature rise and at a suitable vapour pressure, a plume of evaporant.  Under regular e-beam evaporation, the chamber pressure is as low as possible to prevent chemical reaction with the film or bulk evaporant.  Under carefully controlled partial pressures of reactive gases, reactive e-beam evaporation gives films of different chemical composition to the bulk material.

 

说明: Click to view Photo-SY-PVD75_3QTR-THUMB.jpg

 

MAGNETRON SPUTTERING SYSTEM

Early diode sputter sources used continued targets to shape the electrical field to optimize the plasma.  But the diode’s inefficiency and complex target have meant it hs been mostly superseded by sources with magnetic fields near the target.  Three significant effects resulted: the target shapes are now disks, tubes, or rectangles, electron loss from the plasma is reduced; and the electron’s path length is increased.  The resulting magnetrons sputter source’s denser plasma greatly increased deposition rates and target utilization.

 

说明: Click to view Photo-SY-PVD75_3QTR-THUMB.jpg说明: http://www.lesker.com/newweb/Vacuum_systems/jpg/Photo/Photo-SY-Nano36_02.jpg

 

UHV SPUTTERING SYSTEM

 

 

CLUSTER TOOL SPUTTERING SYSTEM

Cluster tools offer the most deposition capability of all the KJLC® system platforms, allowing users to incorporate up to 8 deposition modules positioned around a central wafer transfer hub. Nearly every deposition, process, or analysis technique is available as a bolt-on or multi-technique module, including but not limited to, thermal evaporation, organic evaporation, magnetron sputtering, electron beam evaporation, atomic layer deposition, and surface analysis equipment.

The Kurt J. Lesker Company manufactures two standard cluster tool system platforms: Luminos® and OCTOS®.

Each of the cluster tool systems that we manufacture has a variety of features and options suitable to tailor a platform for your particular process needs. These options are based on, but not limited to, modules based on our stand-alone system platforms.

 

 

 

 

 

 

 

Premier Solutions Pte Ltd / The Kurt J. Lesker Company – Chemical Vapor Deposition (CVD)

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