Spin Coating, Etch, Develop, and Clean

Spin Coating, Etch, Develop, and Clean

Spin Coating, Etch, Develop, and Clean

The Laurell Technologies WS-650 Spin Coater series is an advanced research and development tool which is flexible, safe and affordable.  It is typically employed for Solvent, Base or Acid-based processing: Coating, Etching, Developing, Rinsing-Drying and Cleaning.  Many dispense options both manual and automatic available.  The Laurell Spin Coater is compact and packed with advanced features. The 650-series coater system will accommodate up to ø150mm wafers and 5" × 5" (127mm × 127mm), ø200mm wafers and 7" × 7" (178mm × 178mm) and ø300mm wafers and 9" × 9" (229mm × 229mm substrates, and features a maximum rotational speed of 12,000 RPM (based on a ø100mm silicon wafer).

 

                        

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The Laurell EDC-650 series EDC Spin Processor is an advanced research and development tool which is flexible, safe and affordable.  The EDC™ series is typically employed for both solvent and aqueous-based processing: Etch-Rinse-Dry, Develop-Rinse-Dry, as well as solvent and aqueous cleaning.  The spin processor features a zero-porosity Teflon® fluid path with an onboard dispense valve manifold.  A clear ECTFE dome-shaped lid allows safe visibility of your process as it runs, even during single-step process development mode (an exclusive Laurell Technologies capability).

The EDC™ system (shown) features programmable valves leading to single injector chemical dispense for repeatability required for Etch, Develop, and Cleaning applications where a rinse (typically DI water or solvent) then dry (typically N2) are the final process steps.  With this sequential valving technique the wafer and plumbing begin and end the process completely dry.  Isolated and independent injectors are available in static positions yet adjustable within the lid.  Optional dynamic linear or dynamic radial dispensing is also within the systems attributes.  Although a non-vacuum chuck is always recommended for these processes the system has a vacuum hold-down capability as well

The Laurell EDC-650 series EDC Spin Processor is compact and packed with advanced features. This 650-series EDC system will accommodate up to ø150mm wafers and 5" × 5" (127mm × 127mm), ø200mm wafers and 7" × 7" (178mm × 178mm) and ø300mm wafers and 9" × 9" (229mm × 229mm) substrates. Even though this system has a 12,000 RPM capability with vacuum hold-down, it is recommended for only 3,000 RPM and non-vacuum chucks.

 

                        

 

 

 

Premier Solutons Pte Ltd / Laurell Technologies Corporation / Spin Coating, Etch, Develop, and Clean / Spin Coater

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