Bismuth (Bi) Sputtering Targets

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Description

Premier Solutions Pte Ltd is distributing Kurt J Lesker Coporation (KJLC) comprehensive offering of sputtering targets, evaporation sources and other deposition materials which  is listed by material throughout the website. Technical specifications of Bismuth (Bi) Sputtering Targets and ordering information is available.  Below you may find budgetary pricing for sputtering targets and deposition materials per your requirements. Actual prices may vary due to market fluctuations. Contact This email address is being protected from spambots. You need JavaScript enabled to view it. for current pricing or for a quote on sputtering targets and other deposition products not listed.

 

Specifications

Material Type Bismuth   Theoretical Density (g/cc) 9.8
Symbol Bi Z Ratio 0.79
Atomic Weight 208.9804 Sputter DC
Atomic Number 83 Max Power Density(Watts/Square Inch) 15
Color/Appearance Lustrous Reddish White, Metallic
Thermal Conductivity 8 W/m.K Type of Bond Indium
Melting Point (°C) 271  
Coefficient of Thermal Expansion 13.4 x 10-6/K

Material Notes

  • Some materials and manufacturing methods may yield product with higher than average porosity. Performance may be affected according to process requirements.
  • Some materials and manufacturing methods may yield product with surface imperfections. In many cases, these imperfections are merely visual defects. Performance may be affected according to process requirements.

 

Ordering Table

Materials Size Purity Parts # Price
Bismuth 1.0" Dia. x 0.125" Thick 99.999% EJTBIXX501A2 P.O.R.
Bismuth 1.0" Dia. x 0.250" Thick 99.999% EJTBIXX501A4 P.O.R.
Bismuth 2.0" Dia. x 0.125" Thick 99.999% EJTBIXX502A2 P.O.R.
Bismuth 2.0" Dia. x 0.250" Thick 99.999% EJTBIXX502A4 P.O.R.
Bismuth 3.0" Dia. x 0.125" Thick 99.999% EJTBIXX503A2 P.O.R.
Bismuth 3.0" Dia. x 0.250" Thick 99.999% EJTBIXX503A4 P.O.R.
Bismuth 4.0" Dia. x 0.125" Thick 99.999% EJTBIXX504A2 P.O.R.
Bismuth 4.0" Dia. x 0.250" Thick 99.999% EJTBIXX504A4 P.O.R.

 

Bonded Assemblies Ordering Table

Material Size Purity Bonding Type Backing Plate Size Part # Price
Bismuth 2.00" Dia x 0.125" Thick 0.99999 Elastomer 2.00" Dia x 0.125" Thick EJUBIXX502A4 P.O.R.

 

 

Premier Solutions Pte Ltd - Bismuth (Bi) Sputtering Targets - BiST1

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